The BASF Ultrafuse PA is an FFF filament based on copolyamide 6/66 which has a lower melting point than PA6 and PA66 and can be printed at lower temperatures. It also has better impact resistance. The material features high strength and modulus and shows good thermal stability. It allows building semi-flexible thin parts yet remaining rigid at higher thickness.
The Ultrafuse PA has pretty moderate printing conditions and can be used with most open system FFF 3D printers. The nozzle temperature of 220–250 °C and 90–120 °C heated glass print bed are recommended by the manufacturer. It is also advisable to apply some adhesive to the print surface to avoid first layer print failures.
The BASF Ultrafuse PA is well suited for building parts that require strength and durability yet featuring flexibility. It is widely used in engineering industry for fabrication of end-use parts and components, such as electrical appliances and others.
Print bed temperature: 90–120 °C
Nozzle temperature: 220–250 °C
Recommended bed surface: Glass + PVA / Kapton tape / PA adhesive
Nozzle diameter: ≥ 0.4 mm
Print speed: 30–60 mm/s
Printed part density: 1115 kg/m³
Tensile strength, ISO 527: 61.4 MPa (XY), 16.4 MPa (ZX)
Elongation at break, ISO 527: 9.6% (XY), 0.8% (ZX)
Young’s modulus, ISO 527: 2419 MPa (XY), 2122 MPa (ZX)